德律TR7500SII介紹:
結合大FOV之上視3-CCD彩色相機及四個傾斜角度相機以優(yōu)化測試涵蓋率,比TR7500檢測速度快兩倍以上。搭配多區(qū)域且高彈性的RGB+W彩色光源系統(tǒng),配合低角度的光源設計,可提供極性及黑色元器件更好的檢測方案,并且可針對無鉛和傳統(tǒng)組裝電路板上的微小元件01005及提供更精準穩(wěn)定的檢測能力。
德律TR7500SII特性:
1.高速與多角度影像的在線彩色自動光學檢測
2.大尺寸相機可針對微小元件01005做檢測
3.性價比高的高測試涵蓋率AOI解決方案
德律TR7500SII規(guī)格:
Optical System
Imaging Method | Dynamic Imaging |
Top Camera | XGA 3CCD color camera, FOV image size (1536 x 2048 pixel) |
Angle Camera | XGA mono camera, FOV image size (1536 x 2048 pixel) |
Imaging Resolution | 10 μm, 12 μm, 15 μm (factory setting) |
Lighting | Multi-segment, multi-angle RGB LED (coaxial lighting optional) |
3D Technology | N/A |
Max. 3D Range | N/A |
Inspection Performance
Imaging Speed | 10 μm: 44 cm2/sec 12 μm: 69 cm2/sec 15 μm: 93 cm2/sec |
Motion Table & Control
X-Axis Control | 伺服 馬達搭配DSP運動控制系統(tǒng) |
Y-Axis Control | 伺服 馬達搭配DSP運動控制系統(tǒng) |
Z-Axis Control | N/A |
X-Y Axis Resolution | 1 μm |
Board Handling
Max PCB Size | TR7500 SII: 510 x 460 mm TR7500L SII: 660 x 610 mm |
PCB Thickness | 0.6-5 mm |
Max PCB Weight | TR7500 SII: 3 kg (5 kg optional) TR7500L SII: 5 kg (8 kg optional) |
Top Clearance | 40 mm |
Bottom Clearance | 40 mm |
Edge Clearance | TR7500 SII: 3.5 mm TR7500L SII: 3 mm |
Conveyor | Inline Height: 880 – 920 mm * SMEMA Compatible |
Inspection Functions
Component | Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Lifted Component |
Solder | Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination |