德律TR7550SII介紹：
結(jié)合大FOV之上視3-CCD彩色相機(jī)及四個(gè)傾斜角度相機(jī)以優(yōu)化測(cè)試涵蓋率，TR7550 SII自動(dòng)光學(xué)檢測(cè)機(jī)利用TRI的動(dòng)態(tài)取像技術(shù)及線性馬達(dá)，能避免如走停式取像所產(chǎn)生的震動(dòng)，提供更精準(zhǔn)穩(wěn)定的爐前爐后檢測(cè)，并且比TR7550檢測(cè)速度快兩倍以上。搭配多區(qū)域且高彈性的RGB+W彩色光源系統(tǒng)，配合低角度的光源設(shè)計(jì)，可提供極性及黑色元器件更好的檢測(cè)方案，并且可針對(duì)無鉛和傳統(tǒng)組裝電路板上的微小元件01005及提供更精準(zhǔn)穩(wěn)定的檢測(cè)能力。
德律TR7550SII特性：
1.采用線性馬達(dá)，高速無震動(dòng)之在線型彩色自動(dòng)光學(xué)檢測(cè)機(jī)
2. 大尺寸FOV之3-CCD彩色相機(jī)可檢測(cè)01005微小元件
3. 先進(jìn)的RGB+W彩色照明系統(tǒng)可提高焊點(diǎn)之檢測(cè)能力
4. 線性馬達(dá)X-Y 平臺(tái)可提供無震動(dòng)精確檢測(cè)
德律TR7550SII規(guī)格：
Optical System
| Imaging Method | Dynamic Imaging |
| Top Camera | XGA 3CCD color camera, FOV image size (1536 x 2048 pixel) |
| Angle Camera | XGA mono camera, FOV image size (1536 x 2048 pixel) |
| Imaging Resolution | 10 μm, 12 μm, 15 μm (factory setting) |
| Lighting | Multi-segment, multi-angle RGB LED (coaxial lighting optional) |
| 3D Technology | N/A |
| Max. 3D Range | N/A |
Inspection Performance
| Imaging Speed | 10 μm: 44 cm2/sec 12 μm: 69 cm2/sec 15 μm: 93 cm2/sec |
Motion Table & Control
| X-Axis Control | Linear motor + linear scale with DSP-based controller |
| Y-Axis Control | Linear motor + linear scale with DSP-based controller |
| Z-Axis Control | N/A |
| X-Y Axis Resolution | 1 μm |
Board Handling
| Max PCB Size | TR7550 SII: 510 x 460 mm TR7550L SII: 660 x 610 mm TR7550LL SII: 850 x 610 mm |
| PCB Thickness | 0.6-5 mm |
| Max PCB Weight | TR7550 SII: 3 kg (5 kg optional) TR7550L SII: 5 kg (8 kg optional) TR7550LL SII: 5 kg (8 kg optional) |
| Top Clearance | 40 mm |
| Bottom Clearance | 40 mm |
| Edge Clearance | TR7550 SII: 3.5 mm TR7550L SII: 3 mm TR7550LL SII: 3 mm |
| Conveyor | Inline Height: 880 – 920 mm * SMEMA Compatible |
Inspection Functions
| Component | Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Lifted Component |
| Solder | Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination |
