德律TR7700QE介紹：
TR7700QE AOI 藉由結(jié)合以四向可調(diào)變數(shù)位條紋光投影為基礎(chǔ)的新世代2D和3D技術(shù)，提供了優(yōu)越的3D錫點(diǎn)和元件組裝檢測(cè)功能。最新的檢測(cè)軟體采用快速CAD資料的編程及高度可客制化模板。
德律TR7700QE特性：
1.優(yōu)越的2D+3D檢測(cè)覆蓋率
2. 四向數(shù)位條紋光投影
3. 3D高度檢測(cè)范圍可高達(dá)40 mm
4. 高速CoaXPress取像
5.可選配3D雷射模組
德律TR7700QE規(guī)格：
Optical System
| Imaging Method | Stop-and-Go Imaging |
| Top Camera | 12 Mpix |
| Angle Camera | N/A |
| Imaging Resolution | 10 μm, 15 μm (factory setting) |
| Lighting | Multi-phase true color LED, Coaxial lighting |
| 3D Technology | Quad Digital Fringe Projectors |
| Max. 3D Range | 12 Mpix@ 10 μm: 0-10 mm 12 Mpix@ 15 μm: 0-40 mm* * Requires GPU card upgrade. The default 3D height is 0 – 20mm |
Inspection Performance
| Imaging Speed | 12 Mpix@ 10 μm: 13.5 cm2/sec 12 Mpix@ 10 μm: 23 cm2/sec with optional CoaXPress 12 Mpix@ 15 μm: 30 cm2/sec 12 Mpix@ 15 μm: 50 cm2/sec with optional CoaXPress Note: Depending on component distribution |
Motion Table & Control
| X-Axis Control | Ballscrew + AC-servo controller (Linear motor optional) |
| Y-Axis Control | Dual driven ballscrew + AC-servo controller |
| Z-Axis Control | Ballscrew + AC-servo controller (optional) |
| X-Y Axis Resolution | 1 μm |
Board Handling
| Max PCB Size | TR7700QE: 510 x 460 mm TR7700L QE: 660 x 610 mm TR7700QE DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane |
| PCB Thickness | 0.6-5 mm |
| Max PCB Weight | 3 kg |
| Top Clearance | 50 mm |
| Bottom Clearance | 40 mm |
| Edge Clearance | 3 mm [5 mm optional] |
| Conveyor | Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component |
Inspection Functions
| Component | Solder Fillet Height Solder Volume % Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination |
| Solder | Solder Fillet Height Solder Volume % Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination |
